Unverified87% confidenceCautionTime unknown
旗舰级i9或Ryzen 9等TDP接近或超过250W的CPU不建议用单塔风冷压制，长时间满载会触发降频，应选双塔风冷或360一体水冷
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87%
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Long-term
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Unverified高TDP（125W以上）的中高端CPU（如i7/i9、Ryzen 9）必须配至少240水冷或6热管以上高端风冷，用百元级塔式风冷会导致降频，散热预算要预留86% similarUnverifiedTDP≥125W的CPU（如i7/i9、R7/R9非满负载）建议选择双塔或6热管以上风冷（压制能力约200-260W），单塔4热管风冷仅适合TDP≤95W的中端U82% similarUnverifiedIntel 13/14代i7及以上高负载可瞬时功耗超250W，必须配置240mm一体式水冷或双塔风冷（如利民PA120），普通下压式风冷会严重降频81% similarUnverifiedi9-13900K/14900K满载功耗可突破250W-300W，必须配备360mm一体式水冷或顶级风冷（如利民FS140）才能压住，塔式风冷会导致降频；散热预算不足时选i7反而实际性能更稳78% similarUnverifiedTDP≥200W的CPU（如i7-14700K、i9系列、R9 7950X）建议上360mm冷排，240mm在满载烤机时会明显压不住导致降频77% similar
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