Unverified88% confidenceDecision RuleTime unknown
散热器标称TDP需比CPU实际功耗预留30%余量，如i5-13600K满载约180W实际功耗，应选支持220W以上的双塔或240一体水冷才能压住Boost频率不降频
1
Sources
88%
Confidence
Long-term
Relevance
-
First Seen
Sources
Related Entities
Related Claims
UnverifiedTDP≥125W的CPU（如i7/i9、R7/R9非满负载）建议选择双塔或6热管以上风冷（压制能力约200-260W），单塔4热管风冷仅适合TDP≤95W的中端U83% similarUnverified标称TDP（如65W）只是基础功耗，Intel的PL2和AMD的PPT才是实际满载峰值，i5-13600K标65W但满载可冲到180W+，选电源和散热要按峰值算而非TDP83% similarUnverifiedTDP≥200W的CPU（如i7-14700K、i9系列、R9 7950X）建议上360mm冷排，240mm在满载烤机时会明显压不住导致降频82% similarUnverified压制i7-14700K/i9-14900K等高功耗CPU需360mm冷排，240mm冷排在满载AVX负载下水温易突破70度触发降频78% similarUnverifiedRTX 3090热设计功耗高达350W，需确认扩展坞电源适配器通常需要650W以上稳定供电76% similar
Cite This Claim
Stable URI
https://kongchang.com/claim/245692API
curl https://kongchang.com/api/v1/knowledge/claims/245692MCP
get_claim(id=245692)