Unverified88% confidenceSolutionTime unknown
标准风道方案：前+底进风(冷空气)→显卡CPU区→后+顶排风(热空气)，进风风扇总数≥出风+1颗形成微正压，是绝大多数中塔机箱的最优起点
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88%
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Long-term
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Unverified机箱风道搭建标准方案：前/下进气+后/上排气，进气风扇数量或风量略大于排气形成微正压，可减少灰尘从缝隙吸入；进气位加装防尘网并配高静压风扇克服网阻84% similarUnverified机箱风道搭配方案：前进后出+顶部出风形成正压差（进风数≥出风数）可减少内部积灰，进风口建议加防尘网；纯负压虽散热略好但缝隙易积灰76% similarUnverified机箱风扇布局遵循前进后出、下进上出的正压/微正压原则：进风数量略多于出风可形成正压减少灰尘从缝隙进入；负压布局（出风多）散热略好但积灰快74% similarUnverified机箱风扇选择需区分风量型与风压型：无阻挡的进/排气位（如机箱侧板、顶部）选高风量(CFM)风扇；穿过散热鳍片或防尘网的位置（如CPU散热器、水冷排、机箱前面板）需选高静压(mmH2O≥2.0)风扇，否则风被鳍片挡回导致散热无效74% similarUnverified机箱风道遵循正压差原则：进风扇总风量应略大于出风扇（如3进2出），形成正压可减少缝隙积灰；纯排气负压会从防尘网外缝隙吸入大量灰尘72% similar
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