Expired60% confidenceFactExact time
Currently, a single HBM3e stack has a maximum capacity of approximately 36GB.
2
Sources
60%
Confidence
Medium-term (~90 days)
Relevance
7/14/2026
First Seen
Valid until: 10/12/2026(expired)
Sources
苹果M7 Ultra芯片曝光：1.5TB统一内存能否重塑本地AI推理格局
Related Claims
UnverifiedThe current maximum capacity of a single HBM3e stack is approximately 36 GB, the DDR5 bus width is only 64 bits, whereas HBM can reach 4096 bits.84% similarUnverifiedThe WSE-3 has 44 GB of on-chip SRAM capacity.77% similarUnverifiedNVIDIA's GB300 is the flagship of the Blackwell Ultra architecture, with a single chip featuring 288 GB of HBM3e memory capacity and total memory bandwidth exceeding 16 TB/s, an improvement of nearly 5× over the H100's 3.35 TB/s.75% similarUnverifiedThe GB300 integrates HBM3e high-bandwidth memory, with a single-card capacity of up to 288GB and memory bandwidth exceeding 10TB/s74% similarVerifiedThe HBM3 memory used by NVIDIA's H100 has a bandwidth of up to 3.35 TB/s.72% similar
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