Unverified50% confidenceFactExact time

目前单颗HBM3e堆叠最大约36GB

1

Sources

50%

Confidence

Medium-term (~90 days)

Relevance

7/14/2026

First Seen

Valid until: 10/12/2026

Sources

苹果M7 Ultra芯片曝光：1.5TB统一内存能否重塑本地AI推理格局

Related Claims

Unverified单颗HBM3e堆叠最大容量目前约36GB，DDR5总线位宽仅为64位而HBM可达4096位84% similar UnverifiedWSE-3片上SRAM容量达44GB77% similar Unverified英伟达GB300为Blackwell Ultra架构旗舰，单颗HBM3e显存容量达288GB，总显存带宽超过16TB/s，相比H100的3.35TB/s提升近5倍75% similar UnverifiedGB300 集成 HBM3e 高带宽内存，单卡容量高达288GB，内存带宽超过10TB/s74% similar Verified英伟达H100采用的HBM3内存带宽高达3.35TB/s72% similar

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