Unverified50% confidenceFactExact time
M1 Ultra通过UltraFusion技术将两颗M1 Max芯片以硅中介层互连,实现内存容量与带宽双重翻倍
1
Sources
50%
Confidence
Long-term
Relevance
7/14/2026
First Seen
Sources
苹果M7 Ultra芯片曝光:1.5TB统一内存能否重塑本地AI推理格局
Related Claims
UnverifiedApple's M-series Ultra chips interconnect two Max chips via UltraFusion technology, achieving inter-chip bandwidth exceeding 2.5 TB/s through a silicon interposer.78% similarUnverifiedThe Apple M2 Ultra chip integrates 134 billion transistors, and the NVIDIA H100 GPU contains 80 billion transistors71% similarVerifiedDeepSeek V4 is fully compatible with domestically produced Huawei Ascend series AI chips, freeing it from dependence on NVIDIA GPUs.64% similar
Cite This Claim
Stable URI
https://kongchang.com/claim/510274API
curl https://kongchang.com/api/v1/knowledge/claims/510274MCP
get_claim(id=510274)