Expired50% confidenceReleaseExact time
Enflame Technology and Pioneer Technology jointly released China's first glass-substrate CoWoS advanced packaging sample for AI computing chips.
1
Sources
50%
Confidence
Medium-term (~90 days)
Relevance
7/23/2026
First Seen
Valid until: 10/21/2026(expired)
Sources
阿里开源2.4T Qwen大模型，中国AI席卷全球竞争格局
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