Unverified88% confidenceTradeoffTime unknown
散热性能接近顶级风冷天花板,可压制主流高端桌面CPU(如i7/i9、R7/R9级别),但面对功耗极端释放(300W+)的超频场景仍不如360一体式水冷
1
Sources
88%
Confidence
Long-term
Relevance
-
First Seen
Sources
Related Entities
Cite This Claim
Stable URI
https://kongchang.com/claim/806621API
curl https://kongchang.com/api/v1/knowledge/claims/806621MCP
get_claim(id=806621)