CXMT (ChangXin Memory Technologies)
A mainland Chinese semiconductor manufacturer with volume DRAM production capability. The company focuses on the research and manufacture of dynamic random-access memory and represents a key enterprise in China's drive toward indigenous semiconductor memory production.
Timeline (last 90 days)
This year's WESEMiBAY specifically invited 43 core Fab wafer manufacturing companies including Hua Hong Semiconductor, CanSemi, GTA Semiconductor, Yangtze Memory Technologies, Wuhan Xinxin, Nexchip, ChangXin Memory Technologies, and Silan for discussions, attracting over 6,500 professional buyers on site in total.
On October 10, 2026, ChangXin Memory president Cao Kanyu said the company expects to launch a new-generation DDR5 RDIMM product using a 4F² DRAM architecture by the end of the year.
CXMT currently holds approximately 9.5% revenue share of the global DRAM market and has become the world's fourth-largest DRAM manufacturer.
CXMT president Cao Kanyu disclosed a DRAM architecture named 4F², with a new-generation DDR5 RDIMM product using this technology expected to launch by year-end, and the architecture employs VSG (Vertical Surrounding Gate) transistors.
CXMT launched a 34.9 billion yuan capacity expansion plan targeting high-frequency memory chips and advanced processes, with an explicit priority on procuring domestic equipment
If CXMT's production capacity reaches tens of thousands of wafer starts per month or more, it will have a non-negligible disruptive effect on global DRAM supply and demand balance.
The short-term impact of CXMT's capacity expansion may be reflected in domestic substitution procurement on the Chinese mainland, rather than immediately impacting global benchmark prices.
Changxin Memory Technologies (CXMT) announced that its new-generation memory chip platform has officially entered mass production.
CXMT is one of the few companies on the Chinese mainland with DRAM mass production capabilities.
CXMT's currently publicly disclosed mass production node is at the 17 nm level, corresponding to its third-generation DDR4/LPDDR4 products.
4 more timeline events
All Facts (13)
CXMT currently holds approximately 9.5% revenue share of the global DRAM market and has become the world's fourth-largest DRAM manufacturer.
50%UnverifiedThere is still a gap of approximately two generations between CXMT's mass production process node and that of the leading international manufacturers.
50%UnverifiedThe short-term impact of CXMT's capacity expansion may be reflected in domestic substitution procurement on the Chinese mainland, rather than immediately impacting global benchmark prices.
50%UnverifiedCXMT is one of the few companies on the Chinese mainland with DRAM mass production capabilities.
50%UnverifiedCXMT's currently publicly disclosed mass production node is at the 17 nm level, corresponding to its third-generation DDR4/LPDDR4 products.
50%UnverifiedThis year's WESEMiBAY specifically invited 43 core Fab wafer manufacturing companies including Hua Hong Semiconductor, CanSemi, GTA Semiconductor, Yangtze Memory Technologies, Wuhan Xinxin, Nexchip, ChangXin Memory Technologies, and Silan for discussions, attracting over 6,500 professional buyers on site in total.
50%UnverifiedOn October 10, 2026, ChangXin Memory president Cao Kanyu said the company expects to launch a new-generation DDR5 RDIMM product using a 4F² DRAM architecture by the end of the year.
50%UnverifiedCXMT president Cao Kanyu disclosed a DRAM architecture named 4F², with a new-generation DDR5 RDIMM product using this technology expected to launch by year-end, and the architecture employs VSG (Vertical Surrounding Gate) transistors.
50%UnverifiedCXMT launched a 34.9 billion yuan capacity expansion plan targeting high-frequency memory chips and advanced processes, with an explicit priority on procuring domestic equipment
50%UnverifiedIf CXMT's production capacity reaches tens of thousands of wafer starts per month or more, it will have a non-negligible disruptive effect on global DRAM supply and demand balance.
50%UnverifiedChangxin Memory Technologies (CXMT) announced the launch of risk mass production of HBM3 hundred-million-level memory.
50%UnverifiedCXMT's HBM is expected to be commercially available as early as 2027.
50%UnverifiedCXMT (Changxin Memory Technologies) has begun small-volume production of HBM3 high-bandwidth memory.
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