[KongchangAI]
ConceptHBM3

HBM3

The third-generation standard for High Bandwidth Memory, with per-stack bandwidth reaching 819 GB/s. It is used to meet the extremely high memory bandwidth demands of AI and high-performance computing.

Core Facts

Timeline (last 90 days)

Oct 12

High-end AI accelerators such as the NVIDIA H100 integrate HBM3

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Sep 11

Changxin Memory Technologies (CXMT) announced the launch of risk mass production of HBM3 hundred-million-level memory.

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Sep 11

CXMT (Changxin Memory Technologies) has begun small-volume production of HBM3 high-bandwidth memory.

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Sep 8

A high-end AI training card may require 80 GB or even more HBM3 memory.

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Sep 8

The HBM3 used in NVIDIA's H100 provides over 3 TB/s of bandwidth, and HBM is primarily supplied by three manufacturers: SK Hynix, Samsung, and Micron.

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Aug 23

HBM通过TSV(硅通孔)垂直互连多层DRAM,HBM3为8-12层,TSV是直径约5-10微米的铜柱

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Aug 4

The NVIDIA H100 comes with 80GB of HBM3 memory

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All Facts (7)

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