ProductEMIB
Intel EMIB
Intel's Embedded Multi-die Interconnect Bridge technology, used to interconnect multiple chiplets at high density within a package, improving integration and performance.
Timeline (last 90 days)
Oct 13
The chiplet architecture, which splits an SoC into multiple small chips, manufactures each using the most suitable process, and then interconnects them through advanced packaging (such as TSMC CoWoS and Intel EMIB), is the current mainstream design paradigm for high-performance processors.
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