ProductCoWoS
TSMC CoWoS
TSMC's advanced packaging technology, whose full name is Chip on Wafer on Substrate. It is used to integrate multiple chips at high density and is widely applied in high-performance computing and AI chips.
Timeline (last 90 days)
Oct 13
The chiplet architecture, which splits an SoC into multiple small chips, manufactures each using the most suitable process, and then interconnects them through advanced packaging (such as TSMC CoWoS and Intel EMIB), is the current mainstream design paradigm for high-performance processors.
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