TuringQ
A photonic quantum computing company developing chip-scale scalable photonic quantum computers, with products including the TuringQ series.
Timeline (last 90 days)
Beginning with the second-generation TuringQ Gen2, TuringQ's photonic quantum computers use a standard IDC rack form factor and can operate at room temperature.
In September 2026, TuringQ launched the third-generation large-scale chip-level scalable photonic quantum computer TuringQ Gen3, achieving a fully chip-based architecture based on high-speed programmable thin-film lithium niobate photonic quantum chips and employing a space-time multiplexing architecture.
TuringQ Gen3's Gaussian boson sampling computing unit is named "Zhiyuan 3," and the official claim is single-chip ten-thousand-photon scale and million-mode count, achieving chip-level quantum advantage within a set loss boundary.
The TuringQ team reduced the photon circuit transmission loss of thin-film lithium niobate photonic quantum chips to 0.03 dB/cm, with key single-device insertion loss below 0.1 dB, fiber-to-chip single-end coupling loss of 0.9 dB/facet, and wafer-level quantum light source spectral purity exceeding 99%.
The Advanced Intelligent Computing Alliance (FAIC) was first initiated in 2022 by four companies—TuringQ, MetaX, UCloud, and NeuroXess—covering different tracks including quantum computing, computing power chips, computing center construction, and brain-computer interfaces.
This year TuringQ serves as rotating chair of the Advanced Intelligent Computing Alliance (FAIC), and the alliance decided to expand, admitting embodied intelligence companies such as Fourier Intelligence, with membership growing from the original four to dozens.
The Guangdong-Hong Kong-Macao Quantum-Supercomputing-Intelligent Fusion Computing Center is jointly advanced by TuringQ together with Asia Computing Power and Zhicheng Suanwang, benchmarked against overseas quantum-classical hybrid computing centers that have already been deployed at scale.
All Facts (7)
The TuringQ team reduced the photon circuit transmission loss of thin-film lithium niobate photonic quantum chips to 0.03 dB/cm, with key single-device insertion loss below 0.1 dB, fiber-to-chip single-end coupling loss of 0.9 dB/facet, and wafer-level quantum light source spectral purity exceeding 99%.
50%UnverifiedTuringQ Gen3's Gaussian boson sampling computing unit is named "Zhiyuan 3," and the official claim is single-chip ten-thousand-photon scale and million-mode count, achieving chip-level quantum advantage within a set loss boundary.
50%UnverifiedBeginning with the second-generation TuringQ Gen2, TuringQ's photonic quantum computers use a standard IDC rack form factor and can operate at room temperature.
50%UnverifiedThe Advanced Intelligent Computing Alliance (FAIC) was first initiated in 2022 by four companies—TuringQ, MetaX, UCloud, and NeuroXess—covering different tracks including quantum computing, computing power chips, computing center construction, and brain-computer interfaces.
50%UnverifiedIn September 2026, TuringQ launched the third-generation large-scale chip-level scalable photonic quantum computer TuringQ Gen3, achieving a fully chip-based architecture based on high-speed programmable thin-film lithium niobate photonic quantum chips and employing a space-time multiplexing architecture.
50%UnverifiedThe Guangdong-Hong Kong-Macao Quantum-Supercomputing-Intelligent Fusion Computing Center is jointly advanced by TuringQ together with Asia Computing Power and Zhicheng Suanwang, benchmarked against overseas quantum-classical hybrid computing centers that have already been deployed at scale.
50%UnverifiedThis year TuringQ serves as rotating chair of the Advanced Intelligent Computing Alliance (FAIC), and the alliance decided to expand, admitting embodied intelligence companies such as Fourier Intelligence, with membership growing from the original four to dozens.
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