Unverified85% confidenceDecision RuleTime unknown
单塔6热管风冷理论压制TDP约200-220W，可满足i5/i7非旗舰或R5/R7全核睿频；i9/R9旗舰长时间满载建议双塔或240水冷起步
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Unverified单塔6热管风冷（如AS500PLUS）散热极限约200-220W，超过i7-13700K/R7 7800X3D级别的高功耗U建议上双塔或360水冷88% similarUnverifiedTDP≥125W的CPU（如i7/i9、R7/R9非满负载）建议选择双塔或6热管以上风冷（压制能力约200-260W），单塔4热管风冷仅适合TDP≤95W的中端U84% similarUnverifiedi9-13900K/14900K满载功耗可突破250W-300W，必须配备360mm一体式水冷或顶级风冷（如利民FS140）才能压住，塔式风冷会导致降频；散热预算不足时选i7反而实际性能更稳79% similarUnverified旗舰级i9或Ryzen 9等TDP接近或超过250W的CPU不建议用单塔风冷压制，长时间满载会触发降频，应选双塔风冷或360一体水冷76% similarUnverified240mm一体式水冷压制能力约250W，360mm约300W+；但压制i5/R5等中端U，360水冷相比高端风冷收益极小，属于性能过剩73% similar
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