Unverified85% confidenceDecision RuleTime unknown
中端CPU（i5/R5、TDP≤125W）选240mm冷排即可满足散热，上360mm属于性能过剩，多花的钱换来的温差通常＜5度
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Unverifiedi5/R5级别中端CPU（TDP 65-125W）搭配240mm冷排即可，360mm对这类平台散热收益不足5度，属于性能溢出94% similarUnverified散热配置需匹配CPU功耗：i5/R5级别（65-125W）风冷即可；i7/R7以上或K系列（150W+）建议240水冷；i9/R9（250W+）需360水冷否则满载会撞温度墙降频86% similarUnverified散热方案与CPU发热匹配：i5/R5用双热管风冷即可，i7/R7建议6热管风冷或240水冷，i9/R9满载功耗高应上240/360水冷，风冷选购需确认机箱限高（多数塔式风冷高155-165mm）84% similarUnverified压制13代i7/i9或Ryzen 9等高功耗CPU（TDP≥200W）必须选360mm冷排，240mm在满载烤机时会出现温度墙降频84% similarUnverified散热性能释放看整机功耗(TDP)而非CPU型号：同样i7-13700H，性能释放可从35W到75W不等，购买前查实测双烤数据，CPU单烤≥55W才算释放到位79% similar
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