Unverified90% confidenceDecision RuleTime unknown
压制13代i7/i9或Ryzen 9等高功耗CPU（TDP≥200W）必须选360mm冷排，240mm在满载烤机时会出现温度墙降频
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Unverified中端CPU（i5/R5、TDP≤125W）选240mm冷排即可满足散热，上360mm属于性能过剩，多花的钱换来的温差通常＜5度84% similarUnverified散热选择按CPU的TDP/PL2功耗墙：65W以下用百元风冷即可，i5-13600K/R7 7700X(105-125W)需塔式双风扇风冷或240水冷，i7/i9及K系解锁PL2达200W+建议360水冷压制82% similarUnverifiedCPU与GPU的功耗需匹配整机散热上限：14英寸小机身选i9/R9+RTX4070会因散热墙导致双烤降频，14寸首选中端U（R7 8845HS/i7-14650HX）搭配60-90W显卡更均衡82% similarUnverified散热配置需匹配CPU功耗：i5/R5级别（65-125W）风冷即可；i7/R7以上或K系列（150W+）建议240水冷；i9/R9（250W+）需360水冷否则满载会撞温度墙降频81% similarUnverifiedCPU散热器限高必须匹配：塔式风冷（如利民PA120高约157mm）需机箱CPU散热限高≥160mm，ITX机箱普遍限高在120-160mm，选下压式风冷或矮塔更稳妥81% similar
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