Unverified88% confidenceDecision RuleTime unknown
CPU散热器限高必须匹配：塔式风冷（如利民PA120高约157mm）需机箱CPU散热限高≥160mm，ITX机箱普遍限高在120-160mm，选下压式风冷或矮塔更稳妥
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Unverified压制13代i7/i9或Ryzen 9等高功耗CPU（TDP≥200W）必须选360mm冷排，240mm在满载烤机时会出现温度墙降频81% similarUnverified散热配置需匹配CPU功耗：i5/R5级别（65-125W）风冷即可；i7/R7以上或K系列（150W+）建议240水冷；i9/R9（250W+）需360水冷否则满载会撞温度墙降频81% similarUnverified品牌机的默认散热(尤其风冷下压式)常压不住高端CPU满载，i7/i9或R7/R9级别建议确认是否配240mm以上水冷或高规格塔式风冷，否则会触发降频80% similarUnverified机箱风道遵循前进后上出原则，风冷CPU散热器高度需小于机箱限高（多数中塔160-170mm），240水冷需确认机箱顶部/前部支持冷排安装位79% similarUnverified轻薄本散热能力决定实际性能：同样搭载H45芯片，双风扇+3热管的机型可稳定释放40W+，而单风扇薄机型可能只有25-30W，性能相差30%以上，务必查看实测功耗墙数据而非CPU型号79% similar
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