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Unverified88% confidenceDecision RuleTime unknown

MOS管/功率器件散热选导热硅胶垫，导热系数需≥3.0 W/m·K，厚度0.5-1.0mm适配大多数散热器与器件间隙

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Unverified散热贴导热的关键是背胶的导热系数而非贴纸主体，普通亚克力胶导热约0.2 W/m·K会形成热阻瓶颈，应选导热硅胶背胶(1-3 W/m·K)版本84% similar Unverified散热片必须配合导热硅胶垫（导热片）使用，硅胶垫本身导热系数（一般6-12W/mK）是决定散热效果的关键短板，选购时应确认附带足够厚度的原装导热垫82% similar Unverified显卡显存与供电MOS必须使用导热垫（Thermal Pad）而非硅脂，导热垫厚度需按原厂规格选（常见0.5/1.0/1.5/2.0/3.0mm），厚度选错会导致压不紧（过薄）或压碎核心/翘曲PCB（过厚），建议购买硬度85A以下、导热系数≥12.8W/mK的软质导热垫80% similar Unverified同一位置若既要绝缘又要导热，硅胶垫越厚导热越差：0.5mm比2.0mm热阻可低数倍，应在保证爬电距离的前提下选最薄规格79% similar Unverified标称导热系数≥8.5 W/m·K 的硅脂适合超频/高负载散热平台（如i9/Ryzen9搭配360水冷），主流风冷压制65-125W处理器选4-6 W/m·K即可，性能差异通常在2-4℃78% similar

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