Unverified82% confidenceTradeoffTime unknown
导热系数与耐压等级往往矛盾：高填充导热硅胶（>6 W/m·K）填料多导致击穿电压下降，高压场景需重点核对耐压参数而非只看导热
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82%
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Unverified同一位置若既要绝缘又要导热，硅胶垫越厚导热越差：0.5mm比2.0mm热阻可低数倍，应在保证爬电距离的前提下选最薄规格81% similarUnverified散热贴导热的关键是背胶的导热系数而非贴纸主体，普通亚克力胶导热约0.2 W/m·K会形成热阻瓶颈，应选导热硅胶背胶(1-3 W/m·K)版本80% similarUnverified导热系数越高的导热垫通常越硬、压缩性越差，太硬的高导热垫在间隙不均时接触反而变差；软性硅脂型导热垫贴合好但导热略低，需在贴合度和数值间权衡77% similarUnverified散热片必须配合导热硅胶垫（导热片）使用，硅胶垫本身导热系数（一般6-12W/mK）是决定散热效果的关键短板，选购时应确认附带足够厚度的原装导热垫77% similarUnverified普通密封润滑用硅脂勿当导热硅脂用于CPU：其导热系数通常<1 W/m·K，散热效果极差会导致CPU过热降频77% similar
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