Unverified90% confidenceDecision RuleTime unknown
散热是CPU性能的天花板：同一颗H系CPU在单风扇薄本上只能稳定释放35-45W，双风扇双热管游戏本可稳定65W+，购买前必查该机型的实测性能释放（PL1功耗墙）而非只看CPU型号
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Unverified轻薄本散热能力决定实际性能：同样搭载H45芯片，双风扇+3热管的机型可稳定释放40W+，而单风扇薄机型可能只有25-30W，性能相差30%以上，务必查看实测功耗墙数据而非CPU型号85% similarUnverified游戏本选购看散热优先级高于CPU代际：同价位下选双风扇四出风口+均热板的机型，实测烤机CPU温度可控制在85℃以内，性能释放比薄机身高15-20%83% similarUnverified供电相数与散热直接影响CPU持续性能：搭配i7/R7及以上不带核显的CPU，建议供电≥12+2相且带实心装甲散热片，否则高负载易触发降频83% similarUnverified一体机内部空间紧凑散热受限，同型号CPU的性能释放通常低于台式机，长时间高负载易触发降频；选购时优先看是否配备双风扇或专用散热风道设计82% similarUnverified散热性能释放看整机功耗(TDP)而非CPU型号：同样i7-13700H，性能释放可从35W到75W不等，购买前查实测双烤数据，CPU单烤≥55W才算释放到位81% similar
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