Unverified50% confidenceFactExact time
AMD MI300X通过将8个HBM3堆叠体封装于同一基板实现了192GB容量
1
Sources
50%
Confidence
Long-term
Relevance
7/20/2026
First Seen
Sources
Related Claims
UnverifiedAMD Instinct MI300X具有192GB HBM3堆叠内存，对标H100的80GB HBM383% similarUnverifiedAMD MI300X GPU的HBM显存容量最高可达192GB82% similarUnverifiedMI355X配备HBM3e内存，带宽可达数TB/s量级71% similarUnverifiedAMX的核心组件包括默认8个二维Tile寄存器（每个最大可达1KB，即16行×64字节）、TILECFG指令，以及TDPBF16PS、TDPBSSD等矩阵乘法指令70% similarUnverified目前单颗HBM3e堆叠最大约36GB70% similar
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