Unverified50% confidenceFactExact time
AMD MI300X通过将8个HBM3堆叠体封装于同一基板实现了192GB容量
1
Sources
50%
Confidence
Long-term
Relevance
7/20/2026
First Seen
Sources
Related Claims
UnverifiedThe AMD Instinct MI300X features 192 GB of HBM3 stacked memory, compared to the H100's 80 GB of HBM3.83% similarUnverifiedThe AMD MI300X GPU's HBM memory capacity can reach up to 192GB.82% similarUnverifiedThe MI355X is equipped with HBM3e memory, with bandwidth reaching the order of several TB/s.71% similarUnverifiedAMX的核心组件包括默认8个二维Tile寄存器（每个最大可达1KB，即16行×64字节）、TILECFG指令，以及TDPBF16PS、TDPBSSD等矩阵乘法指令70% similarUnverifiedCurrently, a single HBM3e stack has a maximum capacity of approximately 36GB.70% similar
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