ConceptDRIE
Deep Reactive Ion Etching
A semiconductor micromachining process that uses alternating etching and passivation steps to carve high-aspect-ratio vertical structures into silicon wafers. It is one of the key processes in the manufacture of MEMS devices.
Timeline (last 90 days)
Oct 16
Deep reactive ion etching (DRIE) uses alternating etching and passivation steps to etch high-aspect-ratio vertical structures into silicon wafers, and is a core process in the manufacture of MEMS gyroscopes.
Unverified50%