ProductHigh Bandwidth Memory 4 Enhanced
HBM4E
An enhanced specification of HBM4 that further increases the number of stacked layers and per-package capacity, with single-package capacity projected to exceed 48 GB. HBM4E is primarily targeted at high-end AI training workloads.
Timeline (last 90 days)
Sep 20
Samsung Electronics plans to more than double the production volume of its next-generation high-bandwidth memory (HBM4 and HBM4E) DRAM.
Unverified50%
Sep 20
HBM4E is an enhanced version built on top of HBM4, targeting high-end AI training scenarios that are extremely sensitive to bandwidth.
Unverified50%