High-NA EUV
A next-generation extreme ultraviolet lithography system developed by ASML, featuring a numerical aperture increased from 0.33 to 0.55, which yields approximately 40% higher theoretical resolution. It is a critical manufacturing tool for angstrom-level advanced chip processes.
Timeline (last 90 days)
High-NA EUV (High Numerical Aperture Extreme Ultraviolet Lithography), developed and manufactured by ASML, raises the numerical aperture from 0.33 in existing EUV to 0.55, theoretically improving resolution by approximately 40%.
A single High-NA EUV machine is priced at approximately $350 million to $400 million, more than double the cost of existing EUV machines.
TSMC has already procured High-NA EUV equipment for research and development.
All Facts (3)
High-NA EUV (High Numerical Aperture Extreme Ultraviolet Lithography), developed and manufactured by ASML, raises the numerical aperture from 0.33 in existing EUV to 0.55, theoretically improving resolution by approximately 40%.
50%UnverifiedA single High-NA EUV machine is priced at approximately $350 million to $400 million, more than double the cost of existing EUV machines.
50%UnverifiedTSMC has already procured High-NA EUV equipment for research and development.
50%