Xu Songyu, Director of the Wireless Terminal Chip Product Management Department of Huawei's semiconductor business, introduced that the Kirin 9050 Pro has a top metal pitch of 720 nanometers, and this generation achieves a hybrid bonding pitch of 1.5 micrometers; according to Huawei's research, a ratio of hybrid bonding pitch to top metal pitch of less than 3 is an important condition for achieving effective logic folding.