Xu Songyu
Director of the Wireless Terminal Chip Product Management Department in Huawei's semiconductor business, responsible for product planning and management of Huawei's Kirin series chips.
Timeline (last 90 days)
Xu Songyu, Director of the Wireless Terminal Chip Product Management Department of Huawei's semiconductor business, introduced that the Kirin 9050 Pro has a top metal pitch of 720 nanometers, and this generation achieves a hybrid bonding pitch of 1.5 micrometers; according to Huawei's research, a ratio of hybrid bonding pitch to top metal pitch of less than 3 is an important condition for achieving effective logic folding.
Xu Songyu revealed that the Kirin 2027 chip is already in Huawei's hands, and that all test results so far have met expectations.
Logic folding faces two unavoidable engineering problems, heat dissipation and yield, and Huawei will work with industry partners to improve yield, with Xu Songyu stating that no single company can answer all the answers alone.
At the 2026 Huawei Terminal Innovation Technology Communication Meeting, Xu Songyu, head of the Wireless Terminal Chip Product Management Department of Huawei's semiconductor business, revealed that the next-generation Kirin 2027 chip is ready and all test results meet expectations; terminal products based on Kirin chips have shipped over 100 million units cumulatively since 2023, and the Kirin 9050 series has successfully entered mass production.
All Facts (4)
Xu Songyu, Director of the Wireless Terminal Chip Product Management Department of Huawei's semiconductor business, introduced that the Kirin 9050 Pro has a top metal pitch of 720 nanometers, and this generation achieves a hybrid bonding pitch of 1.5 micrometers; according to Huawei's research, a ratio of hybrid bonding pitch to top metal pitch of less than 3 is an important condition for achieving effective logic folding.
50%UnverifiedXu Songyu revealed that the Kirin 2027 chip is already in Huawei's hands, and that all test results so far have met expectations.
50%UnverifiedLogic folding faces two unavoidable engineering problems, heat dissipation and yield, and Huawei will work with industry partners to improve yield, with Xu Songyu stating that no single company can answer all the answers alone.
50%UnverifiedAt the 2026 Huawei Terminal Innovation Technology Communication Meeting, Xu Songyu, head of the Wireless Terminal Chip Product Management Department of Huawei's semiconductor business, revealed that the next-generation Kirin 2027 chip is ready and all test results meet expectations; terminal products based on Kirin chips have shipped over 100 million units cumulatively since 2023, and the Kirin 9050 series has successfully entered mass production.
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