Unverified50% confidenceFactExact time
Advanced packaging is one of the key technology paths for extending Moore's law, including 2.5D/3D integration, through-silicon vias (TSVs), chiplet interconnect, and fan-out wafer-level packaging.
1
Sources
50%
Confidence
Long-term
Relevance
11/3/2026
First Seen
Sources
Related Entities
Related Claims
UnverifiedFrom planar to FinFET to GAA, the logic of transistor evolution has always been to bring the gate closer to the channel and wrap it more comprehensively, achieving less leakage through better control.65% similarUnverifiedHybrid bonding is a three-dimensional integration technology that directly bonds two wafers or dies, achieving electrical interconnection through direct copper-to-copper contact and dielectric layer bonding, with interconnect pitch reducible from tens of micrometers to a few micrometers or even sub-micrometer levels.64% similar
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