Unverified50% confidenceFactExact time
Ultra Fusion is Apple's technology for connecting two identical chips together; the multi-chip approach is adopted because a single silicon die is constrained by manufacturing costs, yield, and lithography exposure area limitations.
1
Sources
50%
Confidence
Long-term
Relevance
9/23/2026
First Seen
Sources
Related Entities
Related Claims
VerifiedApple's M-series Ultra chips interconnect two Max chips via UltraFusion technology, achieving inter-chip bandwidth exceeding 2.5 TB/s through a silicon interposer.72% similarUnverifiedM1 Ultra通过UltraFusion技术将两颗M1 Max芯片以硅中介层互连，实现内存容量与带宽双重翻倍63% similarVerifiedThe M5 Ultra is very likely to adopt UltraFusion dual-chip interconnect packaging technology, combining two M5 Max-level chips into a single logical unit.62% similar
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