[KongchangAI]
ConceptLiquid Cooling / 液冷散热

Liquid Cooling

A heat dissipation technology in which a cold plate is attached directly to a chip and a circulating coolant carries away heat. Its cooling efficiency is several times that of air, making it suitable for high power density AI training clusters.

Timeline (last 90 days)

Oct 14

A single Blackwell GPU can consume up to over a thousand watts, and the overall power consumption of a rack can exceed 100 kilowatts, whereas an air-cooled rack can usually only handle 20-30 kilowatts.

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Oct 13

Liquid cooling runs coolant directly through cold plates or heat exchange units within the switch rack; once a pump, valve, pipe, or coolant distribution unit (CDU) fails or needs to be isolated for maintenance, heat removal capability drops within seconds to minutes, and switch chips may trigger protective downclocking or shutdown.

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Oct 12

Although advanced cooling solutions such as liquid cooling and rear-door heat exchangers can alleviate power and thermal bottlenecks, they significantly increase deployment complexity and operations and maintenance costs.

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Sep 5

Introducing liquid cooling solutions into power banks adds extra failure points such as liquid sealing and micro-pumps, presenting additional reliability considerations compared to traditional power banks.

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Aug 28

微软、谷歌等公司已在部分数据中心试点部署液冷方案

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