Wanxin Expo 2026 Opens: Over 1,000 Companies Converge, a Full Scan of Debut Breakthroughs

On October 14, the 2026 Bay Area Semiconductor Industry Ecosystem Expo (Wanxin Expo) opened at the Shenzhen Convention and Exhibition Center (Futian). With nearly 80,000 square meters of exhibition space, over 1,000 semiconductor companies, and a dense schedule of new product debuts, Shenzhen once again became the focal point of the global semiconductor industry.

This year's expo is themed "Chip Toward the Future, Intelligently Creating the Ecosystem," guided by China International Engineering Consulting Corporation, and hosted by the Shenzhen Semiconductor and Integrated Circuit Industry Alliance and Shenzhen Major Industry Investment Group Co., Ltd. From EDA/IP, equipment and materials, and core components to manufacturing and packaging/testing, and computing applications, a complete industry chain is presented in full view within the exhibition halls.

Full Industry Chain Assembly: A Closed-Loop Display from EDA to Computing Power

In addition to the four core exhibition zones—wafer fabrication, compound semiconductors, advanced packaging, and IC design/AI infrastructure—this year's Wanxin Expo has specially created the AI+3D IC Advanced Packaging Innovation Zone and the Third-Generation Semiconductor National Technology Innovation Center Innovation and Industry Ecosystem Zone. It has also newly established the AIE AI Infrastructure Industry Ecosystem Exhibition—from AI chips and computing architecture, intelligent computing centers to high-speed interconnect and green computing power—providing a one-stop display stage for "chip-computing synergy."

The exhibitor lineup covers key nodes of the global semiconductor industry chain. International leaders such as ASML, Applied Materials, Lam Research, TEL, and KLA are assembled alongside domestic mainstays including Naura, AMEC, ACM Research, Piotech, Hwatsing Technology, and SMEE. In addition, materials and component suppliers such as Merck, SCREEN, DISCO, EDWARDS, and FerroTec, as well as packaging/testing and materials companies including Huatian Technology, SiEn, Zhonghuan Leading, Jinko, and Jiangfeng Electronics, are all present, bringing the total number of exhibitors to over 1,000.

This lineup sends a signal: domestic semiconductor equipment and materials are moving from "single-point breakthroughs" to "systematic display." When EDA tools, thin-film deposition equipment, metrology and inspection equipment, and compound semiconductor materials can form upstream-downstream synergy within the same exhibition hall, the industry chain's collaborative capability is no longer just a concept.

Supplementary note: The positioning of several international and domestic manufacturers mentioned in this article within the industry chain

ASML is the only company in the world capable of producing EUV lithography machines, holding an absolutely critical position in advanced processes; Applied Materials, Lam Research, and TEL are known as the world's three major semiconductor equipment giants, respectively strong in deposition/ion implantation, etching/thin films, and coating/development/cleaning; KLA has long held a leading share in the metrology and inspection equipment market.

Domestically, Naura covers multiple product lines including etching, PVD, CVD, and furnace tubes, making it a leading platform-type equipment company in China; AMEC is internationally competitive in etching and MOCVD; ACM Research focuses on cleaning equipment and electroplating; Piotech focuses on thin-film deposition; Hwatsing Technology started with CMP (chemical mechanical polishing) equipment and has extended into ion implantation; SMEE is the main domestic player in lithography machines.

On the materials side, Merck and FerroTec provide electronic materials and components; SCREEN and DISCO have advantages in cleaning equipment and dicing/grinding equipment respectively; EDWARDS is known for subsystems such as vacuum pumps. In the packaging/testing segment, Huatian Technology, and on the materials side SiEn, Zhonghuan Leading, Jinko, and Jiangfeng Electronics cover key nodes such as packaging/testing services, silicon wafers, and targets, respectively.

Debut Matrix: Dense Breakthroughs in Domestic Equipment and Materials

This year's Wanxin Expo has built a "debut matrix" for new technologies, new products, and new achievements to be unveiled in a concentrated manner. At the opening ceremony summit, companies including Qiyunfang, Hwatsing Technology, Changfei Advanced, Leadmicro, CETC Equipment, Piotech, and Shenzhen Pinghu Laboratory debuted their latest achievements in a concentrated fashion.

In terms of EDA and design tools, Qiyunfang launched China's first domestic EDA system-level electronic design toolchain, exploring a systematic design path for domestic industrial software and filling practical gaps in related fields. In terms of key equipment, Hwatsing Technology released a medium-current ion implanter product, continuing to tackle the localization of key equipment; technological progress by SMEE and other companies in lithography and equipment fields also drew attention.

In the thin-film deposition field, Leadmicro introduced its all-new iMagtron series magnetron sputtering system (PVD) and a dedicated ALD system for Ru ultra-thin film processes, achieving full-system coverage of the three mainstream thin-film deposition technology routes: ALD, CVD, and PVD. Piotech brought its new product Flowable Carbon, which through precursor selection and process condition control stably achieves two flowable carbon film processes with different filling properties (Capi-Carbon and Sedi-Carbon).

In advanced packaging metrology and inspection, CETC Equipment released the Venus 6 series advanced packaging metrology and inspection equipment, the first domestic tool capable of simultaneously performing multi-process synchronized metrology and inspection on large-size glass substrate TGV (through-glass via) and RDL (redistribution layer).

In the compound semiconductor field, Changfei Advanced focused on the main drive scenario for new energy vehicles, releasing a high-performance SiC MOSFET series (including an 8-milliohm product), and simultaneously launched a self-developed embedded PCB power module, introducing advanced interconnect processes. Shenzhen Pinghu Laboratory brought the world's first 8-inch GaN-on-SiC enhancement-mode high electron mobility transistor (HEMT) process platform, directly addressing current bottlenecks in the gallium nitride industry and supporting efficient power supply in high-end applications.

The first-day new product launch event was held at 9F17 in Hall 9, where companies including AMEC, Zhongxin Wafer, Inovance Technology, Hive Interconnect, Zhilicube, Deep Intelligent Control, TRI, Zhixin Microelectronics, and Yingjie Chenhui also debuted multiple new products in a concentrated manner.

About several key equipment and material concepts covered in this article:

Ion implanters are core doping equipment in wafer fabrication. By accelerating specific ions and implanting them into silicon wafers, they precisely control the conductivity type and concentration of semiconductor materials. According to beam current size, they can be divided into medium-current, high-current, and high-energy ion implanters. Medium-current models are mainly used for conventional doping processes and have long been dominated by international manufacturers such as Applied Materials, making localization relatively difficult.

Thin-film deposition covers three mainstream technology routes: ALD (atomic layer deposition), CVD (chemical vapor deposition), and PVD (physical vapor deposition). ALD is known for single-atomic-layer precision and is suitable for high-aspect-ratio structures; CVD offers fast film formation rates and broad applicability; PVD is mostly used for metal interconnect layers. Equipment manufacturers capable of covering all three routes simultaneously are rare globally.

Glass Substrate and TGV (through-glass via) are emerging directions in advanced packaging. Compared with traditional organic substrates, glass substrates offer better flatness, thermal stability, and electrical performance, and are regarded as an important technology path for AI chip packaging. TGV refers to creating vertical conductive vias in glass, while RDL (redistribution layer) is responsible for signal rerouting between the chip and substrate. Metrology and inspection of both are key steps for ensuring yield.

GaN-on-SiC refers to a heterostructure in which gallium nitride is epitaxially grown on a silicon carbide substrate, combining the high-frequency and high-power characteristics of GaN with the high thermal conductivity advantages of SiC, making it suitable for high-end RF and power electronics scenarios. Enhancement-mode (E-mode) HEMTs can achieve normally-off operation, better aligning with actual power circuit requirements, and mass production on an 8-inch platform is an important industry breakthrough.

Academicians Discuss: From Scientific Frontiers to Industrial Pathways

On the first day of the expo, the opening ceremony and Semiconductor Industry Development Summit, the Bay Area Integrated Circuit Science and Technology Conference, and a series of professional forums were held concurrently. The summit focused on AI application-driven chip design and the development and market dynamics of the semiconductor manufacturing industry, extending to frontier scientific exploration and releasing China's chip science progress.

Dr. Yin Zhiyao, Chairman and General Manager of AMEC, launched an initiative for co-building the semiconductor industry ecosystem at the conference, calling for consolidating industry consensus, pooling innovation efforts, and promoting the construction of a new industry ecosystem with global core competitiveness, independent controllability, and collaborative innovation.

At the opening ceremony and special forums of the Bay Area Integrated Circuit Science and Technology Conference, academicians including Mao Junfa, Chang Ruihua, and Guo Yongxin gathered with guests from academia and industry to exchange views on frontier topics such as chip materials and device development, artificial intelligence, optical chips, and AI empowerment. In addition, more than 10 professional technical forums were held concurrently around five major directions: wafer fabrication, compound semiconductors, advanced packaging, IC design, and AIE AI infrastructure. Frontier exploration in academia and real-world needs in industry collided and interacted through these exchanges.

More Than an "Expo": The Linking Logic of the Bay Area Ecosystem

Wanxin Expo's positioning goes beyond being merely an exhibition. Before the expo, the event held special matchmaking sessions in industrial cluster cities such as Beijing, Shanghai, Guangzhou, Wuxi, Hefei, Wuhan, Chengdu, Chongqing, and Shenyang, with the number of group professional visitors increasing significantly compared with previous editions. Among the more than 1,000 exhibitors this year, about 80% are from outside Shenzhen, a proportion indicating that Wanxin Expo's industrial radiation is continuing to expand.

During the expo, leveraging major industrial projects and application markets in the Guangdong-Hong Kong-Macao Greater Bay Area, the event builds diverse scenarios such as supply chain procurement matchmaking, investment and financing roadshows, and dual investment and talent attraction, promoting a closed loop of "technology-industry-finance" on the expo site.

From newly released equipment and material achievements to cross-city industrial matchmaking, and then to supporting arrangements for investment, financing, and talent introduction, Wanxin Expo is attempting to answer a deeper question: as domestic semiconductors move from "filling chain gaps" to "strengthening the chain," how can an expo upgrade from a display window to infrastructure for industrial collaboration? From October 15 to 16, the Third Bay Area Semiconductor Investment and Financing Strategic Development Forum, the AIE Intelligent Computing Ecosystem Conference, and the Global Industry Analyst Forum will continue to be held, and are worth continued attention.

One-line Summary

Wanxin Expo 2026 opened in Shenzhen, with over 1,000 companies presenting a panoramic display of domestic semiconductor breakthroughs from EDA to computing power.

Paragraph Summary

The 2026 Bay Area Semiconductor Industry Ecosystem Expo opened at the Shenzhen Convention and Exhibition Center, with nearly 80,000 square meters of exhibition space bringing together over 1,000 semiconductor companies and covering the complete industry chain from EDA/IP, equipment and materials, manufacturing and packaging/testing to computing applications. Qiyunfang launched China's first domestic EDA system-level toolchain, Hwatsing Technology introduced a medium-current ion implanter, Leadmicro achieved full-system coverage of the three major thin-film deposition technologies ALD/CVD/PVD, and CETC Equipment released China's first advanced packaging equipment capable of synchronized metrology and inspection of TGV and RDL. In compound semiconductors, Changfei Advanced released a high-performance SiC MOSFET series, and Shenzhen Pinghu Laboratory launched the world's first 8-inch GaN-on-SiC enhancement-mode HEMT process platform. Dr. Yin Zhiyao initiated an initiative for co-building the semiconductor industry ecosystem, while academicians including Mao Junfa, Chang Ruihua, and Guo Yongxin discussed topics such as optical chips and AI empowerment. About 80% of exhibitors come from outside Shenzhen, highlighting the radiative influence of the Bay Area semiconductor ecosystem.