Unverified85% confidenceDecision RuleTime unknown
CPU与GPU的功耗需匹配整机散热上限：14英寸小机身选i9/R9+RTX4070会因散热墙导致双烤降频，14寸首选中端U（R7 8845HS/i7-14650HX）搭配60-90W显卡更均衡
1
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85%
Confidence
Medium-term (~90 days)
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-
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Unverified散热判断看双烤（CPU+GPU同时满载）数据：能维持CPU 75℃以下、GPU 80℃以下且总功耗释放≥120W才算合格，避免只看单烤宣传83% similarUnverified压制13代i7/i9或Ryzen 9等高功耗CPU（TDP≥200W）必须选360mm冷排，240mm在满载烤机时会出现温度墙降频82% similarUnverified标称导热系数≥8.5 W/m·K的硅脂适合高端CPU/GPU（如i7/i9、RTX4070以上）满载散热；日常办公和轻度使用选择4-6 W/m·K即可，标称过高的产品实测常有虚标80% similarUnverified供电相数与散热直接影响CPU持续性能：搭配i7/R7及以上不带核显的CPU，建议供电≥12+2相且带实心装甲散热片，否则高负载易触发降频79% similarUnverifiedCPU散热器限高必须匹配：塔式风冷（如利民PA120高约157mm）需机箱CPU散热限高≥160mm，ITX机箱普遍限高在120-160mm，选下压式风冷或矮塔更稳妥78% similar
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