46 related articles

Google and UCSD explore building cloud clusters from old phones, leveraging ARM chip efficiency to cut e-waste and data center carbon footprints.

Analysis of the U.S. ban on Chinese humanoid robots: data security concerns, industrial protection motives, and how the AI race extends into Physical AI and robotics hardware.

Analysis of the U.S. ban on Chinese humanoid robots: data security concerns, industrial protection motives, and how the AI race extends into Physical AI and robotics hardware.

An open-source STEM education robot using Edge Impulse edge AI for local object detection, teaching kids computer vision and ML through an engaging ball-fetching game with anthropomorphic design.

Colibri uses MoE hot-cold separation and 4-bit quantization to run 744B-parameter models like GLM 5.2 on consumer hardware. Learn about its three-tier memory architecture and speculative decoding.

A deep analysis of Apple's restrained AI strategy: historical fast-follower patterns, bubble-bursting logic, hardware moat advantages, and the risks of waiting too long.

Hermes Agent is a mature AI Agent framework with built-in Claude Code and Codex coding capabilities, supporting 200+ models, multi-platform deployment, and WeChat integration. Its layered memory and self-evolution features enable low-Token automated task execution.

DeepSeek V4 official release expected mid-July with peak/off-peak pricing; Meituan open-sources trillion-parameter MoE model LongCat 2.0 with million-token context; Cursor launches iOS app. A quick look at the latest AI industry news.

DeepSeek V4 launches mid-July with peak/off-peak pricing; Meituan open-sources trillion-parameter MoE model LongCat 2.0 with million-token context; Cursor debuts iOS app. A quick look at the latest AI industry news.

Five key AI industry trends: Doubao surpasses 180 trillion daily calls, OpenAI's in-house AI chip, NVIDIA's $3-4 trillion compute forecast, China catching up, and the GPT-5.6 cheating scandal.

This AI Daily covers five sectors: DeepSeek V4 reportedly enters grayscale testing with improved chain-of-thought; Musk previews Grok 4.6 and 5.0 with 2T parameters; Intern-S2 open-source model beats Claude Opus 4.8; xAI builds 2000MW Colossus cluster; NVIDIA RoboTTT breaks long-horizon robotics barriers.

Startup Prismo claims to compress a 27B-parameter model to 4GB for full local inference on iPhone 17 Pro. We break down the compression tech, compare it to Apple's MoE approach, and assess real-world limits.

Apple's 1-bit compression fits 27B models on iPhone, Meta builds custom chip Iris, China's 100K-GPU cluster goes live, Samsung enters AI PC — a deep dive into AI's new full-spectrum competition.

OpenAI launches GPT-5.6, Apple rebuilds Siri, China's AI companionship regulations take effect, Google labels AI images — your one-stop global AI industry roundup.
Block Low-Rank Compression: A Guide to…
Learn how Block Low-Rank (BLR) decomposition compresses large model memory usage and accelerates GPU inference, including CUDA kernel optimization and combination with quantization and pruning.

Mesh LLM is an open-source distributed inference framework that splits model layers across multiple devices, creating a virtual super GPU to run 100GB+ LLMs on consumer hardware.
PrismML Breakthrough: How a 27-Billion…
PrismML compressed Alibaba's Qwen 3.6 from 54 GB to under 4 GB, enabling a fully-activated 27B-parameter model to run locally on iPhone 17 Pro. Here's how.

An in-depth look at the AI strategy of Databricks co-founders Matei Zaharia and Reynold Xin: the open-source Agent platform Omnigents, the unified storage architecture LTAP, and how Dream Engine reshapes data and intelligence.

The MELTing Point paper is the first to evaluate mobile LLM performance in real user scenarios, covering iPhone, Samsung, Pixel and more, testing TinyLlama, Mistral-7B and others—revealing GPU inference gains, 47°C heat warnings, and prefill-decode disaggregation.

DeepSeek is entering AI chip development, targeting compute autonomy. This article analyzes its motivations, software-hardware synergy, chip R&D challenges, and impact on China's AI vertical integration.